Current Activities

• In collaboration with local and regional commercial and industrial entities and national certification laboratories in varies turn-key design projects, such as Sensor Network development, MPU, DSP and FPGA data/signal acquisition & processing module, Communication protocol design and Image/Video signal optimization processing algorithm solution.
• Wireless communication module for Telco grade deployment on P2P and P2mP communication Topology with Full/Partial Mesh backhaul in-linked Network.
• Embedded wireless/wired IoT module in collaboration with industrial counterpart/partners design and development.
• Since 2015, ESN is engaged to design and development standalone embedded module for Sensor Network with High Reliability specification for the purpose of deployment and application into heavy industries environment, such as Foundry Industries, Oil Mining Industries, Satellite Subsystem Application, Underwater Data Acquisition, etc.
• Currently, ESN is engaged to work on wireless wearable IoT solution for human tracking, monitoring and backend processing for data correlation analysis with automatic alarm and alert management.

The design process for ESN on High-Reliability solution are based on it fundamental application where extending from it commercial or industrial design experiences. And most of the High-Reliability solutions are based on their commercial equivalents, with some manufacturing and design variations that reduce the susceptibility to interference from electromagnetic radiation. Hence, the direct conversion of the solution from commercial application to High-Reliability usage is potential, except enhancing of processing power of the “signal and data” acquisition process via High-Reliability embedded DSP processor and FPGA Module. In general, due to the extensive development and testing required to produce a High-Reliability design of a microelectronic chip, High-Reliability chips tend to lag behind the cutting-edge of developments.